Software Defined-Native Storage Solutions

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IOGUARD SPS

SPS(Purley Storage Platform)


Feature Highlights:
Comprehensively Improved Performance Special L-shape motherboard supports Intel® Purley scalable series processors include CPU 81XX (Platinum), 61XX (Gold), 41XX (Silver), and 31XX (Bronze). Which is completely improved in the field of core numbers, frequency, cache, and NT channel. supports DDR4 memory technology, up to 3TB RAMs space by 24 DIMM slots to meet the demand of different application.

Excellent Storage Extendibility
Up to 31x2.5" hot-swap HDD/SSD or 16x3.5"+2x2.5" hot-swap HDD/SSD in 2U space would provide plenty of data storage capability for customers, meanwhile the data protection can be implement by SAS RAID controller,Up to 8x PCI-e expander slot to cover the extendibility need.

Stability perfection
Turn-key system has passed strict testing of compatibility and reliability. This is to guarantee the good quality of server and stability, and make sure the safety and trust of customer's key business.

Outstanding Network and Management Capability
Standard configuration of embedded Intel Ethernet controller provides reliable and fast network connection.support iKVM remote management function with independent 1Gb/s IPMI, it could be controller under BIOS level operation through remote management moduld by keyboard,display and mouse(KVM over Ethernet). Real time monitoring included power on/off by remote management will ensure system administrator to maintain system on time.

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 Model 1U4BAY 1U10BAY 2U8BAY 2U12BAY 2U24BAY
S104
S110
S208
S212
S224
S224N2(2 Node)
S224N4(4 Node)

 Specification Description
- 준비중입니다.
Model S104
CPU Up to 1 or 2 Intel Skylake LGA3647 Xeon processor with OPA (Omni-Path Architecture) support Maximum TDP 165W as standard and conditional up to 205W
Chipset Intel® PCH server C621 series chipset
Memory DDR4 ECC RDIMMs/LRDIMMs server memory, Memory Frequency 1866/2133/ 2400/2666MHz 12x DDR4 Channel, each Channel has 2x DIMM, 24x DDR4 slot totally Support 8GB, 16GB, 32GB, 64GB, 128GB, up to 3.0TB (M processors)
HDD up to 4x hot-swap 3.5 SAS/SATA (HDD/SSD)
I/O Front Port:VGA、2x USB3.0、1x LCD special Mini USB I/O Rear Port:VGA、2x USB3.0、1x IPMI management port、2x RJ45 port
PCI-e Max 2x PCI-e 3.0 slot x16;
Up to 2x full-height half-length PCI-e x16 GPU;
1x non-standard PCI-e x8 SAS/RAID mezzanine
card + 1x non-standard PCI-e
x8 NIC mezzanine card
System Fans N+1 Hot-swap redundant fan system
Temperature Standard Operating Temp:5ºC - 35ºC
( w/o direct sunshine) Expander Operation Temp:5ºC - 40ºC
(Configuration Match Limited)
Transmit Store Temp:-40ºC - 65ºC
Humidity Operating Temp 30% - 80%(none-condensation) Store Temp:5% - 95%( none-condensation)
Power Supply Platinum Level550W、800W、1300W hot-swap redundant CRPS, optional support 240 and 338 VDC PSU
Dimension Width 17.1" (435mm)
Height 1.71" (44mm)
Depth 31.8" (808mm)

 Specification Description
- 준비중입니다.
Model S110
CPU 1 or 2 Intel® Xeon® Scalable Processors with LGA3647 socket, support OPA CPU (Up to TDP 165W, optional TDP 205W)
Chipset Intel® PCH server C621 series chipset
Memory DDR4 ECC RDIMMs/LRDIMMs server memory, Memory Frequency 1866/2133/ 2400/2666MHz 12x DDR4 Channel, each Channel has 2x DIMM, 24x DDR4 slot totally Support 8GB, 16GB, 32GB, 64GB, 128GB, up to 3.0TB (M processors)
HDD up to 10x hot-swap 2.5”SAS/SATA(HDD/SSD) NVMe:up to 10 hot-swap 2.5”NVMe/SAS/SATA(SSD/HDD)
I/O Front Port:VGA、2x USB3.0、1x LCD special Mini USB I/O Rear Port:VGA、2x USB3.0、1x IPMI management port、2x RJ45 port
PCI-e Max 2x PCI-e 3.0 slot x16;
Up to 2x full-height half-length PCI-e x16 GPU;
1x non-standard PCI-e x8 SAS/RAID mezzanine
card + 1x non-standard PCI-e
x8 NIC mezzanine card
System Fans N+1 Hot-swap redundant fan system
Temperature Standard Operating Temp:5ºC - 35ºC
( w/o direct sunshine) Expander Operation Temp:5ºC - 40ºC
(Configuration Match Limited)
Transmit Store Temp:-40ºC - 65ºC
Humidity Operating Temp 30% - 80%(none-condensation) Store Temp:5% - 95%( none-condensation)
Power Supply Platinum Level550W、800W、1300W hot-swap redundant CRPS, optional support 240 and 338 VDC PSU
Dimension Width 17.1" (435mm)
Height 1.71" (44mm)
Depth 31.8" (808mm)

 Specification Description
- 준비중입니다.
Model S208
CPU 1 or 2 Intel® Xeon® Scalable Processors with LGA3647 socket, support OPA CPU (Up to TDP 165W, optional TDP 205W)
Chipset Intel® PCH server C621 series chipset
Memory DDR4 ECC RDIMMs/LRDIMMs server memory, Memory Frequency 1866/2133/2400/2666MHz 12x DDR4 Channel, each Channel has 2x DIMM, 24个DDR4 slot totally Support 8GB, 16GB, 32GB, 64GB, 128GB, up to 3.0TB (M processors)
HDD Front:up to 12x hot-swap 3.5" SAS/SATA (HDD/SSD)
Or up to 25x hot-swap 2.5”SAS/SATA(HDD/SSD)
Rear:up to 6x hot-swap 2.5” SAS/SATA (HDD/SSD)
Or up to 4x hot-swap 3.5”+ 2x 2.5” SAS/SATA(HDD/SSD)
NVMe:up to 16 hot-swap 2.5”NVMe/SAS/SATA(HDD/SSD)
I/O Front port:VGA、2x USB3.0、1x LCD specified Mini USB; Rear port:VGA、2x USB3.0、1x management interface、2x RJ45 port
PCI-e Max 2x PCI-e 3.0 slot x16;
Up to 2x full-height half-length PCI-e x16 GPU;
1x non-standard PCI-e x8 SAS/RAID mezzanine
card + 1x non-standard PCI-e
x8 NIC mezzanine card
System Fans N+1 Hot-swap redundant fan system
Temperature Standard Operating Temp:5ºC - 35ºC
( w/o direct sunshine) Expander Operation Temp:5ºC - 40ºC
(Configuration Match Limited)
Transmit Store Temp:-40ºC - 65ºC
Humidity Operating Temp 30% - 80%(none-condensation) Store Temp:5% - 95%( none-condensation)
Power Supply Platinum Level 550W、800W、1300W hot-swap redundant CRPS, optional support 240 and 338 VDC PSU
Dimension Width 17.5" (445mm)
Height 3.42" (87mm)
Depth 31.8" (808mm)

 Specification Description
- 준비중입니다.
Model S212
CPU 1 or 2 Intel® Xeon® Scalable Processors with LGA3647 socket, support OPA CPU (Up to TDP 165W, optional TDP 205W)
Chipset Intel® PCH server C621 series chipset
Memory DDR4 ECC RDIMMs/LRDIMMs server memory, Memory Frequency 1866/2133/2400/2666MHz 12x DDR4 Channel, each Channel has 2x DIMM, 24x DDR4 slot totally Support 8GB, 16GB, 32GB, 64GB, 128GB, up to 3.0TB (M processors)
HDD Front:up to 12x hot-swap 3.5" SAS/SATA (HDD/SSD)
Or up to 25x hot-swap 2.5”SAS/SATA(HDD/SSD)
Rear:up to 6x hot-swap 2.5” SAS/SATA (HDD/SSD)
Or up to 4x hot-swap 3.5”+ 2x 2.5” SAS/SATA(HDD/SSD)
NVMe:up to 16 hot-swap 2.5”NVMe/SAS/SATA(HDD/SSD)
I/O Front port:VGA、2x USB3.0、1x LCD specified Mini USB; Rear port:VGA、2x USB3.0、1x management interface、2x RJ45 port
PCI-e Max 2x PCI-e 3.0 slot x16;
Up to 2x full-height half-length PCI-e x16 GPU;
1x non-standard PCI-e x8 SAS/RAID mezzanine
card + 1x non-standard PCI-e
x8 NIC mezzanine card
System Fans N+1 Hot-swap redundant fan system
Temperature Standard Operating Temp:5ºC - 35ºC
( w/o direct sunshine) Expander Operation Temp:5ºC - 40ºC
(Configuration Match Limited)
Transmit Store Temp:-40ºC - 65ºC
Humidity Operating Temp 30% - 80%(none-condensation) Store Temp:5% - 95%( none-condensation)
Power Supply Platinum Level 550W、800W、1300W hot-swap redundant CRPS, optional support 240 and 338 VDC PSU
Dimension Width 17.5" (445mm)
Height 3.42" (87mm)
Depth 31.8" (808mm)

 Specification Description
- 준비중입니다.
Model S224
CPU 1 or 2 Intel® Xeon® Scalable Processors with LGA3647 socket, support OPA CPU (Up to TDP 165W, optional TDP 205W)
Chipset Intel® PCH server C621 series chipset
Memory DDR4 ECC RDIMMs/LRDIMMs server memory, Memory Frequency 1866/2133/2400/2666MHz 12x DDR4 Channel, each Channel has 2x DIMM, 24x DDR4 slot totally Support 8GB, 16GB, 32GB, 64GB, 128GB, up to 3.0TB (M processors)
HDD up to 24x hot-swap 2.5”SAS/SATA(HDD/SSD)
Rear:up to 2x hot-swap 2.5” SAS/SATA (HDD/SSD)
NVMe:up to 16 hot-swap 2.5”NVMe/SAS/SATA(HDD/SSD)
I/O Front port:VGA、2x USB3.0、1x LCD specified Mini USB; Rear port:VGA、2x USB3.0、1x management interface、2x RJ45 port
PCI-e Max 2x PCI-e 3.0 slot x16;
Up to 2x full-height half-length PCI-e x16 GPU;
1x non-standard PCI-e x8 SAS/RAID mezzanine
card + 1x non-standard PCI-e
x8 NIC mezzanine card
System Fans N+1 Hot-swap redundant fan system
Temperature Standard Operating Temp:5ºC - 35ºC
( w/o direct sunshine)
Expander Operation Temp:5ºC - 40ºC
(Configuration Match Limited)
Transmit Store Temp:-40ºC - 65ºC
Humidity Operating Temp 30% - 80%(none-condensation) Store Temp:5% - 95%( none-condensation)
Power Supply Platinum Level 550W、800W、1300W hot-swap redundant CRPS, optional
support 240 and 338 VDC PSU
Dimension Width 17.5" (445mm)
Height 3.42" (87mm)
Depth 31.8" (808mm)

 Specification Description
- 준비중입니다.
Model S224N2
CPU Up to 1 or 2 Intel Skylake LGA3647 Xeon processor with OPA (Omni-Path Architecture) support
Chipset Intel® PCH C621 Chipset
Memory 16x 288pin DDR4 DIMM slots
HDD Front drive bay support up to 4x NVMe+8x 2.5” SAS3.0/SATA3.0 and optional rear 2x 2.5”SAS3.0/SATA3.0 hot-swappable HDDs/SSDs (space occupied PCIe slots) per node System up to 8x NVMe+16x 2.5” SAS3.0/SATA3.0 at front and additional 8x 2.5” hot-swappable HDDs/SSDs at rear.
I/O 1x internal USB3.0
2x USB3.0 via specific I/O interface expansion
PCI-e Support 1x PCIe x16 or 2x PCIe x8 Slots
System Fans Up to 4x 8038 or 8056 (dual rotor), support PWM smart fan control
Temperature Op:10℃ ~ 35℃;NON-OP:-40℃ ~ 70℃
Humidity OP:35%~80% ; NON-OP:20% ~ 90%
Power Supply 2x 1+1 redundant PSU
CRPS 1600W or 2000W module 80+ Gold
Dimension Width 17.63" (448mm)
Height 3.46" (88mm)
Depth 27.95" (710mm)

 Specification Description
- 준비중입니다.
Model S224N4
CPU Up to 1 or 2 Intel Skylake LGA3647 Xeon processor with OPA (Omni-Path Architecture) support
Chipset Intel® PCH C621 Chipset
Memory 16x 288pin DDR4 DIMM slots
HDD Front Drive Bay support up to 6x 2.5”and optional rear 2x 2.5 SAS3.0/SATA3.0 hot-swappable HDDs/SSDs (space occupied PCIe slots) per node System up to 32x SAS3.0/SATA3.0 2.5”hot-swappable HDDs/SSDs.
I/O 1x internal USB3.0
2x USB3.0 via specific I/O interface expansion
PCI-e Support 1x PCIe x16 or 2x PCIe x8 Slots
System Fans Up to 4x 8038 or 8056 (dual rotor), support PWM smart fan control
Temperature Op:10℃ ~ 35℃;NON-OP:-40℃ ~ 70℃
Humidity OP:35%~80% ; NON-OP:20% ~ 90%
Power Supply 2x 1+1 redundant PSU
CRPS 1600W or 2000W module 80+ Gold
Dimension Width 17.63" (448mm)
Height 3.46" (88mm)
Depth 27.95" (710mm)